under the reserve that funds are granted
As part of a third-party funded research project, an intermediate substrate layer is being developed in collaboration with an industry partner for processing within standard printed circuit board (PCB) manufacturing processes. This layer integrates high-frequency waveguides for signal transmission as well as miniaturized cooling channels for liquid cooling.
The tasks at TU Berlin focus in particular on integrating this novel intermediate layer into state-of-the-art PCB processes and their associated electronic cooling systems. Another key focus lies on the coupling interfaces, especially for the low-loss coupling and decoupling of high frequencies into and out of the waveguides and onward to subsequent microelectronic system components.
Please send your application with the reference number and the usual documents (one file max. 5 MB) only via email to personal@tmp.tu-berlin.de.
By submitting your application via email you consent to having your data electronically processed and saved. Please note that we do not provide a guaranty for the protection of your personal data when submitted as unprotected file. Please find our data protection notice acc. DSGVO (General Data Protection Regulation) at the TU staff department homepage: https://www.abt2-t.tu-berlin.de/menue/themen_a_z/datenschutzerklaerung/.
To ensure equal opportunities between women and men, applications by women with the required qualifications are explicitly desired. Qualified individuals with disabilities will be favored. The TU Berlin values the diversity of its members and is committed to the goals of equal opportunities. Applications from people of all nationalities and with a migration background are very welcome.
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