part-time employment may be possible; under the reserve that funds are granted
Within a third-party funded research project the TU Berlin will investigate the influence of the quality of copper micro-vias in printed circuit boards on the imitation and development of damage under thermomechanical alternating stress.
The work at TU Berlin focusses on the development on reliability testing and analysis of specially prepared samples and theoretical support through finite element simulation.
Please send your application with the reference number and the usual documents (one file max. 5 MB) only via email to personal@tmp.tu-berlin.de.
By submitting your application via email you consent to having your data electronically processed and saved. Please note that we do not provide a guaranty for the protection of your personal data when submitted as unprotected file. Please find our data protection notice acc. DSGVO (General Data Protection Regulation) at the TU staff department homepage: https://www.abt2-t.tu-berlin.de/menue/themen_a_z/datenschutzerklaerung/.
To ensure equal opportunities between women and men, applications by women with the required qualifications are explicitly desired. Qualified individuals with disabilities will be favored. The TU Berlin values the diversity of its members and is committed to the goals of equal opportunities. Applications from people of all nationalities and with a migration background are very welcome.
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